Bedrock R8000 Edge AI 30W

SolidRun

SolidRun Bedrock R8000 Edge AI 30W AMD Ryzen Embedded 8000 Fanless Industrial PC

1st industrial PC with AMD Ryzen Embedded 8000
Ryzen AI and Hailo AI for over 100 TOPS Generative AI / Inferencing
State of the art thermal design for operation in -40ºC to 85ºC
10 years guaranteed availability

Choose Bedrock R8000 Series Model:

Product Code: Bedrock R8000 Edge AI 30W

Categories: Din Rail PCs, Edge Computing, Fanless Embedded PCs, Fanless Industrial PCs, GPU Computing, HAILO-8 Systems, Industrial Computing, Industrial PCs, SolidRun, SolidRun Bedrock R8000 Series

Range: SolidRun

Details

AMD Ryzen Embedded 8000 Performance, Efficiency & 10 Year Longevity

Bedrock R8000 is powered by the state-of-the-art AMD Ryzen Embedded 8000 processor with 8 Zen 4 cores and 16 threads running at up to 5.1 GHz. It is the most power efficient high-performance x86 CPU on the market for compute and graphics workloads. Ryzen Embedded 8000 incorporates AMD Pro technology for enhanced reliability and security and has 10 years guaranteed availability.

4 Types of AI Engines, over 100 TOPS

Ryzen Embedded 8000 has an integrated Ryzen AI NPU rated at 16 TOPS. The full processor performance scales up to 39 TOPS. Additionally, Bedrock R8000 supports two types of AI accelerators:

Hailo-8 achieves 26 TOPS and excels in AI Inferencing

The new Hailo-10 is optimized for Generative AI and provides 40 TOPS

Up to 3 AI accelerators can be installed in Bedrock R8000 with combined AI performance of over 100 TOPS.

Packed Solid with Features

The I/O, storage and networking devices found in Bedrock R8000 stand out in both performance and capacity. Thanks to its modular design Bedrock R8000 is available with either 4 displays + 2 GbE or 4 GbE + 2 displays. Bedrock R8000 is packed full with sockets for up to 96 GB DDR5 ECC, 3x NVME Gen4 2280 or up to 3 Hailo AI accelerators, WiFi 6E and 5G modem with dual SIM. I/O includes USB4 40 Gbps, extra 4 USB 3.2 ports and a console port. All these features are tightly packed in a fanless enclosure of under 1 liter.

Remarkable Fanless Cooling

Hot chips require innovative cooling. Bedrock was designed from the ground up for effective fanless cooling. The CPU is thermally coupled to the chassis using liquid metal TIM to reduce thermal resistance. Stacked heatpipes distribute the heat evenly 360º around the all-aluminum chassis. To optimize convective heat transfer, each chassis wall has two heat exchange layers – aluminum air-ducts that stimulate airflow by chimney effect, and another layer of conventional cooling ribs. As a result, Bedrock can dissipate over 3 times the power of fanless computers of similar size.

Full Control of CPU Power

With Bedrock R8000 you don’t have to guess how much power the system draws. Instead you can precisely set CPU power limit across an exceptionally broad power range of 8W to 54W. This is particularly useful in scenarios where limited power has to be shared between the IPC and additional devices, and when integration constraints prevent ideal heat dissipation.

Rock Solid Reliability

Bedrock is designed with reliability in mind based on decades of experience in development of IPCs and embedded systems. DC power is through a terminal block with screw locking and has a wide voltage range of 12V – 60V with two stages of regulation. RAM supports ECC. NVMe with power-loss-protection (PLP) can be ordered. Bedrock has redundant SPI Flash to prevent bricking by BIOS corruption as well as WDT and TPM. The enclosure is extremely ruggedized – all-aluminum, fanless and ventless dust-resistant IP40.

Innovative Modular Design

Bedrock is designed to address the diversity of requirements in the IoT space. This is achieved by partitioning the hardware into the following boards:

SoM with the CPU, DDR5 and NVMe slots and all native interfaces on 380 pins of high density connectors.
Networking and I/O board (NIO) with NICs and ports.
Storage and Extension Cards board (SX) with slots for WiFi, 5G modem and extra NVMe devices.
Power Module (PM) with DC to DC converter and DC input connector.

This modular design enables agile customization of Bedrock for addressing specific requirements. SolidRun is developing multiple NIO, SX and PM boards that can be mixed and matched as an off-the-shelf solution and also offers development of custom boards as an ODM service. Customers and 3rd parties that are interested in developing custom NIO, SX or PM boards are welcome to contact SolidRun for support. Bedrock enclosure is designed with customization in mind. Modification of I/O, power input, antenna openings etc. can be performed cost effectively even in small volume.

Painless Integration

The compact footprint of Bedrock, robust structure, effective fanless cooling and DC input tolerance simplify Bedrock integration. All Bedrock I/O is brought to the front panel, with DC input and antennas in the top panel. The bottom and rear panel are both reserved for mounting, allowing full usability while Bedrock is mounted to a wall or to a desk.

SolidRun offers multiple types of mounting brackets, including lever-based DIN-Rail bracket with locking, wall mount, small stand and ruggedized stand.

Field Usability

As a fanless, ventless IPC Bedrock requires no maintenance. Bedrock is designed to avoid the need to open it in the field. SIM cards are accessible from the panel using pin-hole trays. Remote power button connector is conveniently located on the top panel. All brackets and mounting fixtures are assembled from the outside. Should the need arise to open Bedrock (e.g. to install a storage device or replace the RTC battery) Bedrock opens by unscrewing a single screw.

The 0.6 liter Bedrock Tile

When integrating an IPC in tight space convection cooling becomes ineffective and is better replaced with conduction cooling. It is also desirable to make the IPC as compact and thin as possible.

Bedrock Tile is designed for these use cases. The ribbed chassis walls are replaced with flat walls with blind threadings for fastening Bedrock Tile to a cold plate. A key feature of Bedrock Tile is that it preserves the 360º internal heat distribution so it can be cooled from either side. With thickness of just 29mm and volume of 0.6 liter, Bedrock Tile is easy to integrate in tight spaces. Having all connectors on one side further simplifies the integration.

Advanced Integration Using Deck

Some integration scenarios call for custom enclosures (e.g. when additional devices must be installed with the computer in the same housing). To support these use cases Bedrock introduces the Deck concept (deck-of-cards). The SoM, NIO, SX and PM are rigidly held together with fasteners independently of the Bedrock enclosure. The Deck provides first stage cooling for most devices, in particular it includes a copper heat-plate on the CPU. The Deck is fastened to the custom chassis with only 3 screws. Fastening provides thermal coupling to the CPU, RAM, NVMe and FETs. The DC input connector is on wires and can be relocated in the chassis.

System Integration

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Global Operations

We deliver and support products via offices globally

Full Warranty

Industry leading warranties on all solutions as standard

Technical Support

Experienced engineers are on hand to support your project

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Custom Design

Processor Type	AMD Ryzen, up to 8 Cores
GPU	Integrated GPU
AI Engine	Hailo-8
Cooling Type	Fanless
USB Ports	1x USB 4.0, 4x USB 3.2
Ethernet Ports (LAN)	4x 2.5G
Wireless	Cellular, Wi-Fi
Video Ports	1x HDMI, 3x DisplayPort
Storage Type	NVMe: Us to
Input Voltage	12-60 VDC
Mounting Options	DIN-mount, VESA-mount
Operating Temperature	Extra-Wide OT: -40°C to 85°C
OS Support	Linux, Windows 10, Windows 11