FAQ

3D chip stacking, also known as 3D packaging or 3D integration, is a technology used in semiconductor manufacturing where multiple semiconductor dies (chips) are vertically stacked on top of each other to form a single integrated circuit (IC) package.

Industrial automation involves the application of various technologies to automate tasks traditionally performed by humans. It aims to boost productivity, reduce errors, and optimise resource utilisation across different stages of manufacturing, from raw material handling to assembly and quality control.

Tensor cores are renowned for their ability to execute matrix operations swiftly and efficiently. Leveraging parallel processing techniques, these cores handle multiple operations simultaneously, significantly reducing computation time.

M.2 SSDs are compact storage devices that directly plug into your computer’s motherboard.

Solid-State Drives (SSDs) have revolutionised the computing landscape with their cutting-edge storage technology. Unlike traditional Hard Disk Drives (HDDs), which rely on spinning disks, SSDs store data electronically using flash memory.

In the digital age, understanding the fundamental components of computing is essential for navigating the world of technology. Among these components, the CPU (Central Processing Unit) stands as a cornerstone of computer systems, driving performance and executing vital tasks.

Cores serve as the individual processing units within a central processing unit (CPU) or processor.

PCIe stands for Peripheral Component Interconnect Express, a high-speed serial computer expansion bus standard used to connect various hardware components.

Edge AI refers to the deployment of artificial intelligence (AI) algorithms and models directly on edge devices, such as sensors, cameras, and IoT devices, rather than relying on centralised cloud servers for processing.

ARINC 429 is a widely used data bus standard in the aerospace industry, primarily for transferring digital data between avionics systems.