CR900-B

DFI CR900-B Basic Type 2 supports 3rd/2nd Gen Intel Core with DDR3L up to 16GB

End of Life

3rd/2nd Gen Intel® Core™, Intel® QM77 Chipset
Dual channel DDR3L 1600MHz SODIMM up to 16GB
1 x VGA, 1 x LVDS
Multiple expansion: 1 PCIe x16, 4 x SATA, 1 x LPC, 1 x I2C, 1 x SMBus
Rich I/O: 1 Intel GbE, 8 x USB 2.0
7-Year CPU Life Cycle Support Until Q3′ 18 (Based on Intel IOTG Roadmap)

Discontinued
This product is end of life. There may still be stock available; please contact us for more information or suitable replacement solutions.

Product Code: CR900-B

Categories: End of Life Products

Details

DFI has launched Two new COM Express Basic form factor modules - CR901-B Type 6 and CR900-B Type 2, offering the 3rd generation Intel® Core™ processors. The supported processors are built on Intel's 22-nanometer process technology and boast a 15% greater CPU performance over the previous generation processors. The boards support the quad-core Intel® Core™ i7-3610QE and the dual-core Intel® Core™ i5-3610ME processors. These processors offer higher performance at lower power consumption than the 2nd generation Intel® Core™ processors which are also supported on these module boards.

The low power module boards take full advantage of the mobile Intel® QM77 Express chipset which is packed with high performance I/O capabilities to provide increased mobile computing and graphics performance.The Intel® HD Graphics 4000 engine integrated into the processors delivers up to 50% 3D graphics performance improvement and up to 1.8x HD to HD transcode performance increase. Targeted at multimedia and medical applications, CR901-B brings enhanced graphics performance by supporting 3 independent displays in any combination of VGA, LVDS and DDI (HDMI, DVI, DisplayPort, and SDVO) allowing you to choose the best combination to suit various applications requirements. CR900-B on the other hand supports VGA and LVDS interfaces for dual independent display with resolution up to 1920x1200 @ 60Hz.The module boards support the same high performance I/O expansion except for CR901-B which supports the new USB 3.0 that is capable of processing more data load.The mobile embedded module boards are ideal for applications requiring a stable revision-controlled platform, such as gaming, medical equipment, and KIOSK embedded applications.

Ordering Info

CR900-B

Part Number : 770-CR9001-000G

Downloads

DFI CR900-B Datasheet (PDF)

1.76MB

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Specification

System Processor Socket G2 988B for:– 3rd generation Intel® Core™ processors (22nm process technology)Intel® Core™ i5-3610ME, 3M Cache, 2.7GHz (3.3GHz), 35WIntel® Celeron™ 1020E, 2M Cache, 2.20 GHz, 35W– 2nd generation Intel® Core™ processors (32nm process technology)Intel® Celeron™ B810E, 2M Cache, 1.6GHz, 35WIntel® Celeron™ 847E, 2M Cache, 1.1GHz, 17WIntel® Celeron™ 827E, 1.5M Cache, 1.4GHz, 17W Chipset Intel® QM77 Chipset Memory Two 204-pin SODIMM up to 16GB Dual Channel DDR3L 1600MHz BIOS 64Mbit SPI Graphics Controller Intel® HD Graphics 4000 (3rd generation processors) Intel® HD Graphics 3000 (2nd generation processors) Intel® HD Graphics (Intel® Celeron™ processors) Feature DirectX Video Acceleration (DXVA) for accelerating video processing – Full AVC/VC1/MPEG2 HW Decode Supports DirectX 11/10.1/10/9 and OpenGL 3.0 (3rd generation processors) Supports DirectX 10.1/10/9 and OpenGL 3.0 (2nd generation processors) Display 1 x VGA1 x LVDS VGA: resolution up to 2048×1536 @ 75HzLVDS: dual channel 36/48-bit, resolution up to 1920×1200 @ 60Hz Expansion Interface 1 x PCIe x161 x PCIe x4 and 1 x PCIe x1 or 5 x PCIe x14 x PCI1 x LPC1 x IDE1 x I2C1 x SMBus Audio Interface HD Audio Ethernet Controller 1 x Intel® 82579LM (10/100/1000Mbps) I/O USB 8 x USB 2.0 SATA 2 x SATA 3.0 (up to 6Gb/s) RAID 0/1/5/102 x SATA 2.0 (up to 3Gb/s) SSD 1 x 4GB/8GB/16GB/32GB SSD (available upon request) GPIO 1 x 8-bit GPIO Watchdog Timer Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds Power Type 4.75V~20V, 5VSB, VCC_RTC (ATX mode) 4.75V~20V, VCC_RTC (AT mode) Consumption 59.78 W with i7-3610QE at 2.30GHz and 2x 1GB DDR3 SODIMM OS Support OS Support Windows XP Professional x86 & SP3 (32-bit)Windows XP Professional x64 & SP2 (64-bit) Windows 7 Ultimate x86 & SP1 (32-bit)Windows 7 Ultimate x64 & SP1 (64-bit)Windows 8 Enterprise x86 (32-bit) Windows 8 Enterprise x64 (64-bit) Environment Temperature Operating: 0 to 60°CStorage: -20 to 85°C Humidity Operating: 10 to 90% RH Storage: 10 to 90% RH MTBF TBD Mechanism Dimensions COM Express® Basic 95mm (3.74″) x 125mm (4.9″) Compliance PICMG COM Express® R2.1, Type 2 Standards and Certifications Certifications CE, FCC Class B, RoHS, UL Packing List Packing List 1 CR900-B boardHeat sink with fan: 761-111007-000G